CISA-confirmed known exploited vulnerability

CVE-2023-33063

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Qualcomm · Multiple Chipsets

Vulnerability details

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Added to CISA KEV: 2023-12-05

Ransomware campaign use: Unknown

CISA due date: 2023-12-26

Defensive guidance from CISA

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

This is the source's required-action field, not an independently validated patch procedure. Refer to the vendor for exact affected versions and fixes.

Source catalog date: 2026-11-06T19:44:45.1797Z · Last retrieved: 2026-11-06 21:02:26 UTC

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