CVE-2023-33063
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Qualcomm · Multiple Chipsets
Vulnerability details
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Added to CISA KEV: 2023-12-05
Ransomware campaign use: Unknown
CISA due date: 2023-12-26
Defensive guidance from CISA
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
This is the source's required-action field, not an independently validated patch procedure. Refer to the vendor for exact affected versions and fixes.
Source catalog date: 2026-11-06T19:44:45.1797Z · Last retrieved: 2026-11-06 21:02:26 UTC